Product

  • M12
  • heating method
    Pulse
  • press heads
    12groups
  • machine size
    L 1300 x W 1500 x H 2000
  • UPH
    1800
  • M6
  • heating method
    Pulse
  • press heads
    6groups
  • machine size
    L 700 x W 1000 x H 1850
  • UPH
    900
  • M4
  • heating method
    Pulse
  • press heads
    4groups
  • machine size
     L 1400 x W 1200 x H 1850
  • UPH
    600
  • M2
  • heating method
    Pulse
  • Number of press heads
    2groups
  • machine size L
     L 850 x W 1050 x H 1900
  • UPH
    300
  • M4UM
  • UPH
    600
  • feature  
    Uninterrupted flow
  • carrier size(mm)
     L 102 x W 60 x H 12
  • stacking method 
    Servo Drive Magazine
  • number of machine stations
    2
  • machine size(mm)L
     L 900 x W 1200 x H 1850
  • B4T-S
  • heating method
    Pulse
  • Number of press heads
    4groups
  • machine size L
     L1200+600 x W 1200 x H 2000
  • UPH
    300
  • M6R
  • heating method
    Pulse
  • Number of press heads
    6groups
  • machine size LL
     L1200x W 1200 x H 2000
  • UPH
    900
  • P2
  • heating method
    Pulse
  • Number of press heads
    1groups
  • machine size L
     L840 x W 800 x H 1250
  • UPH
    200
  • W1
  • heating method
    Pulse
  • Number of press heads
    1groups
  • machine size
     L640 x W 540 x H 710
  • UPH
    150
  • C1
  • heating method
    Pulse
  • module type selection
    up and down & Left and right
  • Number of press heads
    2 pcs.
  • indenter size
    MAX:30 x 3 or MAX:80 x 3
  • constant temperature accuracy
    The uniform temperature can be controlled within ±3℃
    Support MES communication protocol (additional charge required)
  • module size
    250 x 340 x 250
  • A1
  • heating method
    Pulse
  • press heads
    1groups
  • machine size(mm)L
     L1000 x W 1100 x H 1700
  • PA-1000
  • heating method
    constant temperature
  • press heads
    3groups
  • machine size
     L1500 x W 2000 x H 2000
  • UPH
    1200

Standard Model
SWC3008
General Specification
(Table content can be dragged left and right)
SpecificationContent
Tool NameASTRON (Single Wafer Cleaner)
ModelSWC3008SWC3012SWC3016
No. of Chamber81216
Max. Throughput (wf/hr)480User Spec.User Spec.
Dimension (mm)Width2,2302,3002,300
Length2,1652,7602,760
Height3,1502,4503,150
UsageCleaning & Etching
Wafer Size300mm (200mm Option)
No. of Loadport3 or 4
FAOHT, AGV
ChemicalAcid, Alkali, IPA, Hot DIW, DIW
Robots2 for EFEM & Main (MTR)
Chemical InjectionFront & Backside together
DryIPA liquid + N2
OptionsMegasonic, Nanospray
Uniformity5%